Alexander Everke started his career in the semiconductor industry in 1991 as the marketing manager and director with Siemens. After five years, he then joined Siemens’ spinoff, Munich-based Infineon as the vice president sales, for the Memory Products division. In 2001, Mr. Everke was promoted to the senior vice president sales, accountable for Infineon’s annual global sales of Euro 7.2 billion. His last position with Infineon was as the senior vice president and general manager for the Chip Card & Security ICs business unit before joining NXP Semiconductor UK as the general manager in 2006. In 2007 Mr. Everke was promoted to NXP’s Management Team in Eindhoven, Netherlands. He served as Executive Vice President and General Manager for the Multimarket Semiconductors, High Performance Mixed Signal and Infrastructure & Industrial business units reporting directly to the CEO. In October, 2015, he joined ams AG’s Management Board and became CEO on March 1st, 2016. Mr. Everke holds master’s degrees in electrical engineering and master's in business administration. Mr. Everke is a German citizen.
Mr. Michael Wachsler-Markowitsch joined the company in 2001 and has been its Chief Financial Officer since 2003. He was appointed member of the management board in February 2004. Formerly, he was CFO of Ahead Communications AG, the prior Ericsson Multi Service Access Division, where he was member of the buy-out team with significant international experience in China and South America. Prior to that, he was a tax advisor and auditor with KPMG. Mr. Wachsler-Markowitsch has more than ten years of experience in all aspects of international corporate financial, controlling and tax reporting systems. He is a graduate of the Vienna University of Business Administration. Mr. Wachsler-Markowitsch is an Austrian citizen.
Dr. Thomas Stockmeier (born in 1958) joined the company in 2013 as Executive Vice President and General Manager of the Industrial & Medical business. In July 2014, he was appointed Executive Vice President and General Manager of the Division Sensors and Sensor Interfaces and of Corporate Technology. In October 2014 he was appointed as Member of Management Board and Chief Operating Officer. He has 29 years of experience in the Electronics Industry, having worked 13 years for ABB in Switzerland and in the USA, holding various positions in Research, Development and Management. For the past 13 years he worked as Member of the Management Board and CTO of SEMIKRON in Germany, responsible for R&D, Production, and Quality. Dr. Thomas Stockmeier received a Diploma Degree in Material Science from the University of Erlangen-Nuremberg and a Doctorate Degree in Electrical Engineering from the same University. Dr. Thomas Stockmeier is a German citizen.
Kirk S. Laney was at the helm of TAOS, Inc. since the company’s foundation in 1998 until merging the company in 2011 with ams. Mr. Laney began his 35-year semiconductor industry career in 1980 when he joined the Linear Products Group at Texas Instruments where he was promoted in 1993 to Operations Manager for the TI Optoelectronics Business Unit. Under his leadership, a core team was assembled with the critical competencies necessary to enable the Intelligent Opto Sensor (IOS) strategy. In 1998, under a technology license, Mr. Laney and five colleagues spun off the Optoelectronic Products Group into Texas Advanced Optoelectronic Solutions®, Inc. which he led from a niche market provider to a worldwide leader and technology innovator of opto sensor solutions. Working closely with ams’ Management Board and the Executive Team, Mr. Laney secured production capacity increases and the development of critical technology roadmaps for optoelectronic sensors, allowing ams to achieve a thought leadership position to support emerging markets and applications spaces. Mr. Laney served as ams’ CEO from May 13th, 2013 to February 29th, 2016. Under his leadership, ams defined its strategic focus on sensor solutions and grew significantly – achieving two revenue record years in a row. He holds a Bachelor of Science degree in Physics from Midwestern State University and four patents in optoelectronic packaging. Mr. Laney is a United States citizen.